Author Archives: admin




  • Head Office
  • IB Labs, Inc.
  • 137 West End Ave
  • Brooklyn, NY 11235
  • T: +1 347 708 9400
  • F: +1 347 708 9012
  • E-mail:

Canada Office

  • IB Labs, Inc.
  • 1111 Flint Road, Unit 14
  • North York, ON M3J 3C7
  • T: +1 647 866 7854

Israel Office

  • IB Labs, Inc.
  • 2 Hacarmel St., Alon B Bldg.
  • Southern High-Tech Park
  • Yokneam Illit, Israel 2066724
  • T: +972 54 396 8558

Privacy and Protection

Data Privacy and Protection

The information collected in this form will only be used to ensure that we provide you with an appropriate response based upon the information you provide in the form above. We will contact you only if we need additional information to appropriately answer your question or in order to address your need. The contact information you provide, including e-mail address, may be used to respond to your request. We will not use the contact information you provide in this form for product or promotional advertising unless you specifically request to receive product news or information. For more information, please review our privacy policy


We enable a single, seamless technology to provide comprehensive imaging and compositional analysis.         IB Labs introduces a new concept of in-situ surface preparation for metrology and failure analysis

Who we are

Experts in metrology, failure analysis, electron and ion optics, control and automation

Experienced team in successful delivery for leading global semiconductor companies for over 15 ‎years

Coordinated with well-recognized advisors and collaborators world-wide

Why IB Labs

  • Expertise
    • Team of experts with proven track record to deliver in highly customer-centric environment
    • Successful development and integration of state-of-the-art technologies and tools
  • Intellectual Property (IP)
    • Innovative development approach based on the company IP
  • Best practices
    • Good business and manufacturing practices proven at the leading hi-tech companies

What we do

We design, manufacture and integrate equipment for nano-machining, imaging and failure analysis of integrated circuits and packages.

We enable 3D image reconstruction of structures of interest.

Our technology is compatible with a number of analytical techniques for materials analysis.