Category Archives: INDUSTRIES

Life Science / Interdisciplinary Research

Life Science / Interdisciplinary Research

The usage of our custom designed Duoplasmatron Ion-sources and Ion Beam Optics covers numerous industries and research applications. Additional applications include:

  • Ion beam assisted synthesis of new materials and biomolecules
  • Ion beam bioengineering by low energy ion-beam irradiation of organic and biological objects
  • ‎Discovery of new bio-effects induced by low and high energy ion implantation, e.g. damage and repair of DNA, chromosome structure modifications, cells mutations, …‎

At IB Labs we are continuously developing and improving our ion-sources and ion-optics systems and particularly ‎our ion beam processes. It is by applying the considerable technical knowledge of our experts that we are able to ‎find innovative solutions to scientific and technological challenges, serving the needs of a wide range of industries and ‎consistently delivering added value to our customers.‎

IB Labs is committed to finding innovative solutions to challenging interdisciplinary research applications. Our engineers have ‎worked with clients in different markets to find optimized designs and processes that meet detailed specifications whilst ‎remaining cost effective. If you are interested in utilizing our ion-beam based process and systems, please contact us for ‎further information.‎

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Materials Science and Nanotechnology

Materials Science and Nanotechnology

IB Labs provides state-of-the-art ion-milling-imaging ‎designs and professional support to enable multidisciplinary research in nanomaterials and ‎nanomanufacturing methods related to fundamental materials science, electronics, optics and integrated ‎nanoscale systems. IB Labs’ solutions include in-situ ion polishing, ‎custom ion-source, ion-optics, SEM and STEM handling devices and manipulators, and STEM retractable detectors. Our ion beam processes are ideal for the following applications:

  • Controlled material removal of ‎atomically thin two-dimensional semiconductors, e.g. Transition Metal Dichalcogenides
  • Ion beam modification of functional properties of metals and ceramics
  • Modification of polymers ‎
  • Ion beam assisted synthesis of new materials

In-situ ion-milling: IB Labs provides unique technological solutions for real-time controlled ion-milling and STEM sample preparation while combined with standard electron and optical microscopes

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SEM/STEM handling devices and manipulators: 

IB Labs provides customized solutions for:

  • Vacuum Transfer Systems and Airlocks
  • Eu-centric Manipulators

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Custom STEM retractable detectors: 

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Semiconductors

Semiconductors

IB Labs’ technology tailors to ever shrinking device sizes in the semiconductor industry, in respect to metrology and failure analysis of devices. An innovator in the in-situ surface preparation for electrical and physical failure analysis, IB Labs’ offers advanced integrated ion-milling and imaging solutions.

Typical applications include front-side planar delayering, back-side thinning, ultra-shallow sputtering for elemental and molecular depth profiling and STEM metrology

Front-side planar polishing and delayering:

Usage Benefits
Metal-to-Metal delayering with real-time control and end-point detection over wide variable treatment areas from ~10µm to mm ~10x faster than currently used manual polishing
Search for metal bridging Planarity, depth control, automation superior to manual polisher or BIM
Sample preparation for probing at the metal or contact level Surface roughness superior to FIB
2D-to-3D reconstruction when combined with imaging Multiple treatment sites within a die
Reverse engineering  

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Back-side thinning:

Usage Benefits
Sample preparation for Photoemission (PEM) and Laser Voltage Microscopy (LVx) at the chip or board level Minimal impact on a chip thermal and electrical integrity due to site-specific, non-contact milling
  Variable size, single or multiple treatment areas within a chip

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Surface sputtering for depth profiling:

Usage Benefits
Ultra shallow depth profiling for SIMS, AES and XPS, Raman applications Superior planarity and roughness of a sputter crater compared to state of the art depth-profiling instruments
  Enables unique combination of high-resolution depth profiling and imaging

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STEM Metrology:

Usage Benefits
Unique site-specific STEM preparation at the wafer level STEM sampling and analysis by using both front- and back-side thinning within a chip or wafer without lifting out a specimen
No limitations of lift-out sample size and observation area in a STEM mode as compared to other techniques Enables CD-STEM wafer metrology and defect review

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